1
Picosecond Front Cutting
The 1064 nm infrared picosecond laser forms a high-precision cutting path in the glass with low mechanical stress.
GKS-0706D-GC · Ultrafast Series
Dual-Platform Cold Laser Glass Cutting and Splitting System
Dual tabletop cold laser system for thick glass up to 12 mm, combining infrared picosecond front cutting and CO₂ back splitting for higher efficiency, smooth edges and stable batch production.
- Dual Tabletop400×500 / 600×700 mm
- ≤12 mmGlass thickness
- 500 mm/sMax processing speed
- ±0.002 mmRepeat accuracy
- 1064 nm + 10.6 μmCutting + splitting
Higher-Efficiency Thick Glass Cutting with Dual-Platform Workflow
The GKS-0706D-GC is designed for glass processors that need more efficient thick glass cutting and splitting than a standard single-platform workflow.
This dual-platform cold laser glass cutting system combines 1064 nm infrared picosecond laser cutting with 10.6 μm CO₂ laser splitting. The front cutting and back splitting process helps create a controlled separation path for thick glass while maintaining smooth edge quality.
Compared with a basic integrated thick glass cutting and splitting machine, the dual tabletop configuration is better suited for batch production where loading, cutting, splitting and unloading efficiency matter. It is especially useful for appliance glass, security glass, smart home glass and industrial glass components.
01 · Infrared Picosecond Cutting
Front cutting creates a controlled path inside the glass
The infrared picosecond laser uses high peak energy for cold laser glass processing. It forms a controlled cutting path before the splitting process, reducing mechanical contact and helping preserve edge quality.
1064 nmCutting wavelength
30–70 WLaser power options
02 · Dual-Platform Efficiency
Dual tabletop design improves production rhythm
The dual-platform layout supports a more efficient front cutting and back splitting workflow. It is suitable for production scenarios where one platform can support processing while the other supports loading, unloading or process preparation.
500 mm/sLinear speed
300 mm/sCurved speed
03 · CO₂ Back Splitting
Smooth splitting for thick glass edge quality
After the picosecond laser creates the cutting path, the 10.6 μm CO₂ laser splitting process supports efficient separation. This helps reduce microcracks, breakage and fragment issues in suitable glass applications.
10.6 μmSplitting wavelength
≤12 mmGlass thickness
How Front Cutting and Back Splitting Works
The system is positioned for controlled thick glass separation by combining two laser processes in one production workflow.
2
CO₂ Back Splitting
The 10.6 μm CO₂ laser assists the splitting process, helping separate the thick glass along the prepared path.
3
Dual Tabletop Operation
Dual platforms help improve loading, unloading and production rhythm for batch glass processing projects.
Core Advantages
Designed for thick glass batch production where efficiency, edge quality and process repeatability are important.
Dual-Platform Efficiency
Dual tabletop processing supports a smoother production rhythm for batch thick glass cutting and splitting.
Cold Laser Processing
Infrared picosecond cutting reduces mechanical contact and helps control edge defects in suitable glass.
CO₂ Splitting
10.6 μm CO₂ splitting supports efficient glass separation after the cutting path is formed.
Up to 12 mm Glass
Supports thick glass processing up to 12 mm, depending on material, contour and process conditions.
High Repeatability
Repeat positioning accuracy reaches ±0.002 mm for stable repeated processing.
Where This Dual-Platform System Fits — and Where It Doesn't
Use this section to avoid choosing the wrong ultrafast glass processing equipment.
Best for
- Batch thick glass cutting and splitting production
- Projects where dual tabletop workflow can improve efficiency
- Glass thickness up to 12 mm
- Security glass, appliance glass, smart home glass and industrial glass parts
- Applications requiring smooth separation and stable repeatability
Not for — use a different model
- Standard single-platform thick glass processing → GKS-0706-GC thick glass cutting and splitting machine
- Glass hole drilling → GKS-0605-GD precision glass drilling machine
- Thin cover glass contour cutting → GWK-BL6050 ultrafast glass cutting machine
- FPC, PI film or PET film cutting → dual-platform UV and green laser cutter
Applications
Suitable for thick glass production scenarios where cutting efficiency, edge quality and repeatability are important.
Security Glass
Thick glass cutting and splitting for safety, protection and security-related glass components.
Appliance Glass
Glass panels and functional appliance glass parts requiring stable processing and clean edges.
Smart Home Glass
Smart switches, panels and control glass where appearance and edge quality matter.
Automotive Glass
Selected automotive glass components requiring controlled cutting and splitting workflows.
Industrial Glass
Custom thick glass components used in industrial equipment and manufacturing applications.
GKS-0706D-GC vs. GKS-0706-GC
Both machines are used for thick glass cutting and splitting. Choose the dual-platform system when batch production efficiency is the key requirement.
| Model | Positioning | Processing Area | Best For | Accuracy |
|---|---|---|---|---|
| GKS-0706D-GC | Dual-platform cold laser glass cutting and splitting system | 400 × 500 mm / 600 × 700 mm dual tabletop | Higher-efficiency batch thick glass production | ±0.02 mm within ≤300 mm |
| GKS-0706-GC | Integrated thick glass cutting and splitting machine | 650 × 650 mm | Standard thick glass cutting and splitting projects | ±0.01 mm within ≤200 mm |
Model selection depends on glass type, thickness, contour complexity, target edge quality, production rhythm and loading/unloading requirements. Send drawings for engineering review before purchase.
Not sure whether to choose GKS-0706D-GC or GKS-0706-GC?
Send the glass type, thickness, contour drawing, edge quality target and production volume. Our engineers will recommend the right configuration.
Send Drawing
Technical Parameters
Key specifications for the GKS-0706D-GC dual-platform cold laser glass cutting and splitting system.
| Item | GKS-0706D-GC |
|---|---|
| Machine Model | GKS-0706D-GC |
| Processing Range | 400 × 500 mm / 600 × 700 mm dual tabletop |
| Laser Wavelength | Cutting 1064 nm / Splitting 10.6 μm |
| Repeat Positioning Accuracy | ±0.002 mm |
| Processing Speed | Max 500 mm/s |
| Power Requirement | AC 220 V / 18 A, 5 kW |
| Processing Thickness | ≤12 mm |
| Laser Power | 30 W / 50 W / 70 W optional |
| Comprehensive Processing Accuracy | ±0.02 mm within ≤300 mm |
| Laser Safety Level | Class IV |
| Single Machine Size | 1700 × 1960 × 1950 mm |
Actual glass cutting and splitting quality may vary depending on glass material, thickness, contour shape, edge quality target, fixture condition and process parameters. Verify with a sample test on your actual material.
Related Ultrafast Glass Solutions
Explore related GWEIKE ultrafast glass laser systems, catalog resources and drawing review support for precision glass processing projects.
FAQ
Common questions about dual-platform cold laser glass cutting and splitting.
What is the GKS-0706D-GC used for?
It is used for thick glass cutting and splitting, especially batch production that benefits from dual tabletop front cutting and back splitting.
What glass thickness can it process?
The listed processing thickness is up to 12 mm. Final quality depends on glass type, contour shape, thickness and process parameters.
What does front cutting and back splitting mean?
The system combines 1064 nm infrared picosecond cutting with 10.6 μm CO₂ laser splitting to help create a controlled separation path for thick glass.
How is it different from GKS-0706-GC?
GKS-0706D-GC is positioned for dual-platform, higher-efficiency production. GKS-0706-GC is the standard integrated thick glass cutting and splitting machine.
Is it suitable for glass drilling?
No. For round, square, slot or irregular hole drilling, use the precision glass drilling machine.
Can I send samples or drawings for testing?
Yes. Send the glass type, thickness, contour drawing, edge quality target and expected production volume so engineers can review the process.
Validate Your Dual-Platform Glass Cutting Process Before Buying
Send your glass type, thickness, contour drawing, target edge quality and expected production volume. GWEIKE engineers will review whether the GKS-0706D-GC dual-platform system or another ultrafast glass solution is the better fit.
Drawing review · Process recommendation · Model selection · Engineering-team feedback
Request a Dual-Platform Glass Cutting Review
Share your glass material, thickness, contour drawing, edge quality requirements and production target. Our team will review your application and recommend the right setup.