1
Picosecond Front Cutting
The 1064 nm infrared picosecond laser forms a high-precision cutting path in the glass with low mechanical stress.
GKS-0706D-GC · Dual-Platform Glass Processing
Dual-Platform Front Cutting and Back Splitting Machine
A dual-table thick glass cutting and splitting system combining 1064 nm infrared picosecond front cutting and 10.6 μm CO₂ back splitting for glass up to 12 mm, with smoother edges and higher batch production efficiency.
- 700 × 600 mmDual-table cutting range
- ≤12 mmGlass thickness
- ≤10 μmMinimum edge chipping
- 500 mm/sMax linear speed
- ±0.002 mmRepeat accuracy
Dual-Platform Front Cutting and Back Splitting for Thick Glass
GKS-0706D-GC is designed for thick glass processors that need a dual-platform workflow for front cutting, back splitting and higher-efficiency batch production.
This dual-platform glass processing system combines 1064 nm infrared picosecond laser front cutting with 10.6 μm CO₂ laser back splitting. The process creates a controlled cutting path and then separates thick glass with smoother, taper-free edges under validated process conditions.
Compared with a standard integrated thick glass cutting and splitting machine, the dual-table configuration is better suited for batch production where cutting, splitting, loading and unloading rhythm matters. It is especially useful for security cover glass, smart home glass panels and industrial control glass cover profile cutting.
01 · Infrared Picosecond Cutting
1064 nm infrared picosecond front cutting
The 1064 nm infrared picosecond laser creates a controlled cutting path before splitting. With ultrashort pulse duration and high peak power, heat diffusion is reduced and thermal impact on surrounding glass is minimized under validated process conditions.
1064 nmCutting wavelength
30–90 WCutting power options
02 · Dual-Platform Efficiency
Dual-station workflow for higher batch efficiency
The dual-platform design separates front cutting and back splitting operations so the two processes do not interfere with each other. This helps improve production rhythm for batch thick glass processing.
500 mm/sLinear speed
300 mm/sCurved speed
03 · CO₂ Back Splitting
10.6 μm CO₂ back splitting for smooth thick glass edges
After the picosecond laser forms the cutting path, the 10.6 μm CO₂ splitting process helps separate thick glass with smooth, taper-free edges and reduced edge chipping under validated process conditions.
10.6 μmSplitting wavelength
≤12 mmGlass thickness
How Front Cutting and Back Splitting Works
The system is positioned for controlled thick glass separation by combining two laser processes in one production workflow.
2
CO₂ Back Splitting
The 10.6 μm CO₂ laser assists the splitting process, helping separate the thick glass along the prepared path.
3
Dual Tabletop Operation
Dual platforms help improve loading, unloading and production rhythm for batch glass processing projects.
Core Advantages
Designed for thick glass batch production where efficiency, edge quality and process repeatability are important.
Dual-Platform Efficiency
Dual tabletop processing supports a smoother production rhythm for batch thick glass cutting and splitting.
Cold Laser Processing
Infrared picosecond cutting reduces mechanical contact and helps control edge defects in suitable glass.
CO₂ Splitting
10.6 μm CO₂ splitting supports efficient glass separation after the cutting path is formed.
Up to 12 mm Glass
Supports thick glass processing up to 12 mm, depending on material, contour and process conditions.
High Repeatability
Repeat positioning accuracy reaches ±0.002 mm for stable repeated processing.
Where This Dual-Platform System Fits — and Where It Doesn't
Use this section to avoid choosing the wrong ultrafast glass processing equipment.
Best for
- Batch thick glass cutting and splitting production
- Projects where dual tabletop workflow can improve efficiency
- Glass thickness up to 12 mm
- Security glass, appliance glass, smart home glass and industrial glass parts
- Applications requiring smooth separation and stable repeatability
Not for — use a different model
- Standard single-platform thick glass processing → GKS-0706-GC thick glass cutting and splitting machine
- Glass hole drilling → GKS-0605-GD precision glass drilling machine
- Thin cover glass contour cutting → GWK-BL6050 ultrafast glass cutting machine
- FPC, PI film, PET film, CVL and composite film cutting → GKS-0605D-PI roll-to-sheet precision laser cutting machine
- FPC, PCB, rigid-flex board and camera module cutting → GWK-UV4065 UV and green laser cutter
Applications
Suitable for thick glass production scenarios such as security cover glass, smart home panels and industrial control glass where cutting efficiency, edge quality and repeatability are important.
Security Glass Covers
Camera cover glass, protective lenses and display cover glass requiring controlled thick glass cutting and splitting.
Smart Home Glass Panels
Socket glass covers, display cover glass and smart control panels where edge quality and appearance matter.
Industrial Control Glass
Industrial control cover glass and profile cutting applications for flat thick glass components.
Thick Flat Glass Components
Batch cutting and splitting of flat glass parts up to 12 mm, based on material validation and drawing review.
GKS-0706D-GC vs. GKS-0706-GC
Both machines are used for thick glass cutting and splitting. Choose the dual-platform system when batch production efficiency is the key requirement.
| Model | Positioning | Cutting Range | Best For | Accuracy |
|---|---|---|---|---|
| GKS-0706D-GC | Dual-platform front cutting and back splitting machine | 700 × 600 mm dual table | Higher-efficiency batch thick glass cutting and splitting | ±0.02 mm within ≤300 mm |
| GKS-0706-GC | Integrated thick glass cutting and splitting machine | 700 × 600 mm | Standard thick glass cutting and splitting projects | ±0.02 mm within ≤300 mm |
Model selection depends on glass type, thickness, contour complexity, target edge quality, production rhythm and loading/unloading requirements. Send drawings for engineering review before purchase.
Not sure whether to choose GKS-0706D-GC or GKS-0706-GC?
Send the glass type, thickness, contour drawing, edge quality target and production volume. Our engineers will recommend the right configuration.
Send Drawing
Technical Parameters
Key specifications for the GKS-0706D-GC dual-platform front cutting and back splitting machine.
| Item | GKS-0706D-GC |
|---|---|
| Machine Model | GKS-0706D-GC |
| Product Type | Dual-Platform Front Cutting and Back Splitting Machine |
| Laser Wavelength | Cutting 1064 nm / Splitting 10.6 μm CO₂ |
| Laser Power | Cutting 30 / 50 / 70 / 90 W optional; Splitting 120 W |
| Beam Quality | ≤1.3 |
| Laser Safety Level | Class IV |
| Cutting Range | 700 × 600 mm dual table |
| Machining Thickness | ≤12 mm |
| Minimum Edge Chipping | ≤10 μm |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30–60% |
| Cooling Method | Water cooling |
| Max Machining Speed | 500 mm/s |
| Repeat Positioning Accuracy | ±0.002 mm |
| Overall Machining Accuracy | ±0.02 mm within ≤300 mm |
| Power Requirement | AC220V / 18A / 5KW |
| Machine Size W × D × H | 2200 × 2360 × 1890 mm |
| Weight | Approx. 4,500 kg |
Actual glass cutting and splitting quality may vary depending on glass material, thickness, contour shape, edge quality target, fixture condition and process parameters. Verify with a sample test on your actual material.
Related Ultrafast Glass Solutions
Explore related GWEIKE ultrafast glass laser systems, catalog resources and drawing review support for precision glass processing projects.
FAQ
Common questions about dual-platform cold laser glass cutting and splitting.
What is the GKS-0706D-GC used for?
It is used for thick glass cutting and splitting, especially batch production that benefits from a dual-platform front cutting and back splitting workflow.
What does front cutting and back splitting mean?
The system uses 1064 nm infrared picosecond laser cutting to form the cutting path, followed by 10.6 μm CO₂ laser splitting to separate the glass.
What glass thickness can it process?
The reference machining thickness is up to 12 mm. Actual performance depends on glass type, contour shape, edge quality target and process parameters.
What is the cutting range?
The reference cutting range is 700 × 600 mm with a dual-table workflow.
How is it different from GKS-0706-GC?
GKS-0706D-GC uses a dual-platform workflow for higher batch efficiency. GKS-0706-GC is the standard integrated thick glass cutting and splitting machine.
What should I send for sample testing?
Send glass type, thickness, contour drawing, required edge quality, tolerance and expected production volume so engineers can review the process.
Validate Your Front Cutting and Back Splitting Process Before Buying
Send your glass type, thickness, contour drawing, target edge quality and expected production volume. GWEIKE engineers will review whether the GKS-0706D-GC dual-platform front cutting and back splitting machine or another ultrafast glass solution is the better fit.
Drawing review · Process recommendation · Model selection · Engineering-team feedback
Request a Dual-Platform Glass Cutting Review
Share your glass material, thickness, contour drawing, edge quality requirements and production target. Our team will review your application and recommend the right setup.