Ultrafast Series
Dual-Platform Front Cutting Back Splitting Integrated Machine
Video Show ![Video Show]()
Infrared picosecond laser, high peak
energy vaporizes the glass directly at the
thread penetration point, forming holes,
applying external force can easily and efficiently split.
Dual-platform front cutting back splitting,
high efficiency, linear cutting speed up to
500mm/s, curved speed up to 300mm/s.
No microcracks, breakage, or fragment issues,
high edge fracture resistance.
Consumer electronics, automotive industry, security industry, smart homes.
| Machine model | GSK-0706D-GC |
|---|---|
| Processing Range | 400 x 500mm / 600 x 700mm (dual tabletop) |
| Laser Wavelength | Cutting 1064nm/Splitting 10.6um |
| Repeat Positioning Accuracy | ±0.002mm |
| Processing Speed | MAX 500mm/s |
| Power Requirement | AC220V/18A 5KW |
| Processing Thickness | ≤12mm |
| Laser Power | 30W/50W/70W optional |
| Comprehensive Processing Accuracy | ±0.02mm (≤300mm) |
| Laser Safety Level | Class IV |
| Single Machine Size | 1700 x 1960 x 1950mm |
