Ultrafast Series
Dual-Platform Precision Laser Cutting Machine
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Utilizing ultraviolet picosecond laser, cold processing without carbonization phenomenon; linear motor platform assembled on a marble base, high precision, low maintenance cost.
High-precision mirror processing, high accuracy,
no burrs in cutting; non-contact processing,
no stress deformation, high product qualification rate.
Dual-table design with independent operating platforms, saving loading and unloading time, faster and more efficient processing.
FPC shapes, rigid-flex board opening, PCB separation, camera module, fingerprint recognition module cutting
| Machine model | GWK-UV4065 |
|---|---|
| Laser Wavelength | 355 nm / 532 nm (optional) |
| Laser Power (options) | 15 / 20 / 30 W (optional) |
| Cutting Range | 400 × 650 mm (dual table) |
| Machining Thickness | ≤ 2 mm |
| Beam Quality | ≤1.3 |
| Laser Safety | Class IV |
| Max Scan Speed (Galvo) | 6000 mm/s |
| Repeatability | ±0.002 mm |
| Comprehensive Accuracy | ±0.03 mm (≤300 mm) |
| Cooling | Water‑cooling |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30–60% |
| Power Requirement | AC 220 V / 22.5 A, 5 kW |
| Machine Size (W×D×H) | 1650 × 1800 × 1950 mm |
