Precision cold laser cutting system for FPC, PCB, rigid-flex boards, camera modules, fingerprint recognition modules and thin electronic materials up to 2 mm.
GWK-UV4065 is built for thin, high-value parts that require low heat input, clean edges and stable positioning.
This dual-platform precision laser cutting machine supports 355 nm UV and 532 nm green laser configurations. It is designed for cold, non-contact cutting where burrs, carbonization, stress deformation and material damage must be controlled.
The machine combines a dual-table working structure, linear motor platform and marble base to support batch production of FPC profiles, rigid-flex board openings, PCB separation, camera module parts and fingerprint recognition module components.
UV laser cutting helps reduce carbonization, burrs and heat-affected zones on sensitive electronic materials. The process is suitable for small, thin and high-value components that require clean edges and stable dimensions.
High-precision mirror processing and non-contact laser cutting help reduce stress deformation. The process supports fine contours, small openings and thin part separation with high product qualification rates.
The independent dual-platform structure reduces loading and unloading waiting time. One platform can be prepared while the other is processed, making GWK-UV4065 suitable for efficient precision part production.
Choose the laser wavelength based on material absorption, cutting quality, edge requirement and production target.
UV laser is typically used when the material is sensitive to heat and requires cleaner micro cutting with lower carbonization.
Green laser can be selected for materials that absorb 532 nm more effectively, depending on edge quality and process goals.
Designed for precision electronics cutting where accuracy, thermal control and production rhythm matter.
UV and green laser options help reduce heat effect, carbonization and edge defects on sensitive thin materials.
±0.002 mm repeatability supports fine contours, small openings and repeated precision part processing.
Dual-platform linkage saves loading and unloading time for more efficient batch production workflows.
Linear motor platform assembled on a marble base supports stable motion and lower maintenance requirements.
No mechanical cutting force helps reduce stress deformation and improves processing yield for thin parts.
GWK-UV4065 is focused on precision electronic material cutting and module-level micro processing.
Clean outline cutting for flexible printed circuits and small high-value flexible electronic parts.
Precision openings, windows and shaped cuts for rigid-flex board production and prototyping.
Low-stress PCB depaneling and separation for thin boards and fine electronic assemblies.
Fine cutting for camera module components, small openings and high-precision module structures.
Precision cutting for fingerprint recognition module components requiring clean edges and stable dimensions.
Cutting support for PI film, PET film, cover film, thin glass and selected thin substrate materials.
Use this section to avoid choosing the wrong ultrafast laser platform for your material.
Key specifications for the dual-platform UV and green laser cutting machine. Actual cutting quality should be confirmed by testing your material and drawing.
| Item | GWK-UV4065 |
|---|---|
| Machine Model | GWK-UV4065 |
| Laser Wavelength | 355 nm / 532 nm optional |
| Laser Power Options | 15 / 20 / 30 W optional |
| Cutting Range | 400 × 650 mm dual table |
| Machining Thickness | ≤2 mm |
| Beam Quality | ≤1.3 |
| Laser Safety | Class IV |
| Max Scan Speed | 6000 mm/s |
| Repeatability | ±0.002 mm |
| Comprehensive Accuracy | ±0.03 mm within ≤300 mm |
| Cooling | Water-cooling |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30–60% |
| Power Requirement | AC 220 V / 22.5 A, 5 kW |
| Machine Size W×D×H | 1650 × 1800 × 1950 mm |
Explore related GWEIKE laser systems for glass, ceramic, electronic materials and catalog resources.
Common questions before choosing a UV or green laser cutting machine for precision electronic materials.
It is designed for FPC, PCB, rigid-flex boards, camera modules, fingerprint recognition modules, thin films, thin substrates and selected thin glass materials.
UV laser is commonly used for low-thermal-effect micro cutting of polymer and electronics materials. Green laser can be selected for materials that absorb 532 nm better, such as selected thin glass or special substrates.
The listed machining thickness is up to 2 mm. Actual quality depends on material type, thickness, laser configuration and process parameters.
The dual-table design reduces idle time by allowing loading and unloading on one platform while the other platform is being processed.
No. For thick glass cutting and splitting, use GKS-0706-GC thick glass cutting and splitting machine.
Please send material type, thickness, drawing file, tolerance requirement, edge quality target and expected production volume.
Send your material, thickness, cutting drawing and edge quality target. GWEIKE engineers will review the application and recommend a suitable UV or green laser configuration.
Share your FPC, PCB, thin film, thin glass or module material details. Include thickness, drawing file, tolerance and edge quality requirement so our team can recommend the right setup.
