Clean Film Edge
CO2 sealed RF laser processing supports clean cutting surfaces for selected non-metal film materials.
DC0605 · CO2 Sealed RF Laser
DC0605 PET Film Laser Cutting Machine
CO2 sealed RF laser cutting system for PET film, OCA, polarizer film, GDF film, electronic paper and other non-metal thin film materials. Built with CCD vision positioning, marble base stability and clean film cutting performance.
- CO2 RFSealed laser
- 500 × 600 mmCutting range
- ≤ 1 mmFilm thickness
- 300 mm/sMax speed
- ±0.01 mmRepeatability
CO2 Laser Film Cutting for PET, OCA and Polarizer Materials
DC0605 is a PET film laser cutting machine designed for clean, stable and repeatable cutting of non-metal thin film materials.
Unlike picosecond roll-to-sheet systems used for complex FPC and PI film structures, DC0605 uses a CO2 sealed RF laser for high-precision cutting of PET film, OCA, GDF film, polarizer film, electronic paper and similar non-metal thin film materials.
The system combines CCD automatic positioning, a marble base structure, stable optical components and dedicated fume extraction to help deliver clean film surfaces, consistent edges and easier maintenance in production.
01 · CO2 Sealed Laser
Stable CO2 sealed RF laser cutting for thin film materials
DC0605 uses a CO2 sealed RF laser configuration for non-metal film cutting. The optical path is simple and stable, supporting clean processing of PET film, OCA, polarizer film and other thin film substrates.
C55Laser source optional
Class IVLaser safety
WaterCooling
02 · CCD Positioning
CCD vision positioning for repeated film cutting patterns
Automatic CCD positioning helps reduce manual alignment work and improves consistency when processing printed, laminated, positioned or repeat-pattern thin film parts.
±0.01 mmRepeatability
±0.05 mmComprehensive accuracy
03 · Clean Production
Marble base, fume extraction and low-maintenance film cutting
The reinforced structure, marble base, imported laser source and optical components support stable film cutting. Dedicated fume extraction helps maintain cleaner cutting results for sensitive film materials.
500 × 600 mmCutting range
300 mm/sMax speed
Core Advantages
Focused on thin film cutting quality, stable motion, clean processing and easier maintenance.
CCD Positioning
Automatic CCD vision positioning improves alignment for film patterns and repeated production.
Marble Base
High-stability marble structure helps maintain long-term cutting consistency and machine rigidity.
Low Maintenance
Imported laser source and optical components support stable operation and lower maintenance burden.
Fume Extraction
Dedicated fume extraction helps improve cutting environment and maintain cleaner film surfaces.
Applications for Non-Metal Thin Film Cutting
DC0605 is mainly used for high-precision cutting of non-metal thin film materials in electronics, display and functional film production.
PET Film
Touchscreen PET film and thin PET sheet cutting for electronic and display-related parts.
OCA Film
Optically clear adhesive film cutting where clean edges and stable positioning are required.
Polarizer Film
Polarizer and display film cutting for screen, optical and electronic component workflows.
GDF Film
High-precision cutting of GDF film and similar functional non-metal film materials.
Electronic Paper
Film cutting for e-paper materials and display-related thin material components.
Handwriting Tablet Film
Cutting of handwriting tablet materials and thin functional films used in consumer electronics.
Where DC0605 Fits — and Where It Doesn't
This page is positioned for CO2 sealed laser film cutting. Use the selection notes below to avoid confusing it with picosecond, UV/green or glass-processing systems.
Best for
- PET film, OCA, polarizer film and GDF film cutting
- Electronic paper and handwriting tablet film materials
- Non-metal thin film materials up to 1 mm
- Projects needing CCD alignment and clean film surfaces
- Applications where CO2 sealed RF laser cutting is more economical than ultrafast laser processing
Not for — use a different model
- FPC, PCB and camera module precision cutting → GWK-UV4065 UV / green laser cutter
- High-precision PI, FPC coverlay and composite film cutting → ask about GKS-0605D-PI roll-to-sheet picosecond solution
- Thick glass cutting and splitting → thick glass cutting and splitting machine
- Glass hole drilling → precision glass drilling machine
- Ceramic cutting or scribing → ceramic laser cutting and scribing machine
Not sure whether DC0605 is suitable for your film material?
Send the material type, thickness, film size, drawing and edge quality requirement. GWEIKE engineers will review whether CO2 sealed laser cutting is suitable.
Send Material Details
DC0605-PET Technical Parameters
Key specifications for the DC0605 PET film laser cutting machine. Final cutting quality should be confirmed by sample testing on your actual film material.
| Item | DC0605-PET |
|---|---|
| Machine Model | DC0605-PET |
| Laser Type | CO2 Sealed RF Laser |
| Laser Source | C55 optional |
| Laser Safety | Class IV |
| Cutting Range | 500 × 600 mm |
| Machining Thickness | ≤ 1 mm |
| Max Machining Speed | 300 mm/s |
| Repeatability | ±0.01 mm |
| Comprehensive Accuracy | ±0.05 mm |
| Cooling | Water-cooling |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30–60% |
| Power Requirement | AC 220 V / 14.5 A, 3 kW |
| Machine Size W × D × H | 1350 × 1300 × 1600 mm |
| Typical Kerf Width | 80–150 μm, depending on material and cutting settings |
| Typical Edge Appearance | No visible burrs at 10× for qualified materials and validated process settings |
Price is quoted based on laser configuration, material type, cutting requirement and automation options. Please request a quotation for this machine. Typical kerf width and edge appearance vary by material, thickness, adhesive layer and process parameters.
Related Precision Laser Solutions
Compare DC0605 with other GWEIKE micro and nano laser processing systems for UV/green cutting, glass drilling, thick glass cutting and ceramic processing.
FAQ
Common questions about DC0605 CO2 sealed laser film cutting, material compatibility and sample testing.
What materials can DC0605 cut?
DC0605 is designed for high-precision cutting of non-metal thin film materials, including PET film, OCA, GDF film, polarizer film, electronic paper and handwriting tablet materials.
Is DC0605 a picosecond laser cutting machine?
No. DC0605 uses a CO2 sealed RF laser. For picosecond roll-to-sheet precision cutting, ask GWEIKE engineers about GKS-0605D-PI or other ultrafast laser configurations.
What thickness can this machine process?
It is designed for thin film materials up to 1 mm. Final quality depends on material type, adhesive layer, thickness and cutting parameters.
Why use CCD positioning?
CCD positioning helps improve alignment accuracy for film cutting patterns, printed marks and repeated production batches.
Can it cut PI film or FPC cover film?
It may depend on material and quality requirements. For high-precision PI, FPC, coverlay or rigid-flex applications, GWK-UV4065 or a picosecond roll-to-sheet solution may be more suitable.
What should I send for sample testing?
Please send material type, thickness, roll or sheet size, drawing file, cutting tolerance, edge quality requirement and expected production volume.
Validate Your Film Cutting Process Before Buying
Send your PET, OCA, polarizer, GDF or other non-metal thin film material details. GWEIKE engineers will review the application and recommend whether DC0605 CO2 sealed laser cutting is suitable for your process.
Material review · Sample testing advice · Process recommendation · Quote based on configuration
Request a Film Cutting Review
Share your film material, thickness, roll or sheet size, drawing file and edge quality requirement. Our team will review your application and recommend the right setup.