Using picosecond laser,
fine beam spot, precise cutting seam,
high cutting accuracy.
Dual-mirror dual-head synchronous processing,
high cutting efficiency; using platform and mirror linkage
to avoid accuracy errors caused by splicing.
Automatic feeding, automatic cutting, automatic receiving, roll-to-sheet processing, automated execution of processing programs for unmanned operation, low labor costs.
FPC cover film, PI film, electromagnetic film cutting
| Machine model | DC0605 |
|---|---|
| Laser Type | CO₂ Seal-Off (Sealed) — C55 (optional) |
| Laser Safety | Class IV |
| Cutting Range | 500 × 600 mm |
| Machining Thickness | ≤ 1 mm (films) |
| Max Machining Speed | 300 mm/s |
| Repeatability | ±0.01 mm |
| Comprehensive Accuracy | ±0.05 mm |
| Cooling | Water-cooling |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30–60% |
| Power Requirement | AC 220 V / 14.5 A, 3 kW |
| Machine Size (W × D × H) | 1350 × 1300 × 1600 mm |
| Kerf Width (typical) | 80–150 µm (by material)/td> |
| Edge Appearance | No visible burrs at 10×, minimal HAZ |