Picosecond Cold Processing

Using picosecond laser,
fine beam spot, precise cutting seam,
high cutting accuracy.

Dual Heads for
Higher Efficiency

Dual-mirror dual-head synchronous processing,
high cutting efficiency; using platform and mirror linkage
to avoid accuracy errors caused by splicing.

Automatic Intelligence

Automatic feeding, automatic cutting, automatic receiving, roll-to-sheet processing, automated execution of processing programs for unmanned operation, low labor costs.

Applications

FPC cover film, PI film, electromagnetic film cutting

Technical Parameters

Machine model DC0605
Laser Type CO₂ Seal-Off (Sealed) — C55 (optional)
Laser Safety Class IV
Cutting Range 500 × 600 mm
Machining Thickness ≤ 1 mm (films)
Max Machining Speed 300 mm/s
Repeatability ±0.01 mm
Comprehensive Accuracy ±0.05 mm
Cooling Water-cooling
Ambient Temperature / Humidity 22 ± 2 ℃ / 30–60%
Power Requirement AC 220 V / 14.5 A, 3 kW
Machine Size (W × D × H) 1350 × 1300 × 1600 mm
Kerf Width (typical) 80–150 µm (by material)/td>
Edge Appearance No visible burrs at 10×, minimal HAZ

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