Low Thermal Influence
Picosecond laser processing helps reduce heat-affected cutting defects for PI, PET, CVL and composite flexible materials.
GKS-0605D-PI · Picosecond Roll-to-Sheet Cutting
GKS-0605D-PI Roll-to-Sheet Precision Laser Cutting Machine
Picosecond roll-to-sheet precision laser cutting system for FPC, CVL coverlay film, PI film, PET film, adhesive film, EMI shielding film and composite flexible materials. Built with dual-head dual-platform processing, CCD positioning and a marble motion platform for high-precision flexible material production.
- 532 / 355 nmLaser wavelength
- 30–80 WOptional power
- Dual HeadDual-platform process
- 600 × 300 mmMax format
- ±0.002 mmRepeat positioning
Roll-to-Sheet Picosecond Laser Cutting for FPC, CVL and Composite Films
GKS-0605D-PI is designed for flexible electronics and functional film production where edge quality, positioning accuracy and repeatable roll-to-sheet processing are more important than simple film cutting.
Unlike CO2 film cutters used for simpler PET, OCA and polarizer film cutting, GKS-0605D-PI uses a picosecond laser source, galvanometer scanning system, CCD positioning, marble motion platform, vacuum chuck platform and automatic unwinding mechanism for high-precision flexible material cutting.
The system supports roll-to-sheet processing of FPC substrates, CVL coverlay film, PI / PET / PP films, adhesive films, EMI shielding films, FR4 auxiliary materials and composite film stacks. It is built for projects that require narrow kerf, low thermal influence and stable trajectory control under validated process settings.
01 · Picosecond Laser Source
Small focused spot, low thermal effect and narrow kerf cutting
The high-performance picosecond laser source provides strong beam quality, a small focused spot and uniform power distribution. For PI, PET, CVL and composite film materials, this helps achieve narrow, smooth kerfs and reduce carbonization under validated process settings.
532 / 355 nmLaser wavelength
30–80 WOptional power
500–1000 kHzRepetition rate
02 · Galvo + CCD Positioning
Stable beam trajectory control for complex flexible material patterns
The high-speed galvanometer system and telecentric F-theta lens support stable spot trajectory control. CCD visual positioning helps meet high-precision alignment requirements for FPC, coverlay, adhesive film and repeated pattern processing.
±0.005 mmPlatform positioning
±0.002 mmRepeat positioning
45 × 45 mmGalvo scan range
03 · Dual Head + Dual Platform
Beam splitting enables synchronous dual-platform production
An intelligent beam-splitting device divides one laser source into two beams, enabling dual heads and dual processing platforms to operate synchronously. This structure helps improve production efficiency while keeping maintenance more efficient than operating separate systems.
2 HeadsSynchronous process
600 × 300 mmMax format
X/Y 500 mm/sAxis speed
Core Advantages
Focused on low-thermal precision cutting, roll-to-sheet handling, stable positioning and efficient processing of flexible electronic materials.
Narrow Smooth Kerf
A small focused spot and stable power distribution support narrow and smooth cutting results under validated parameters.
CCD Vision Positioning
CCD positioning helps align printed, laminated and repeated film patterns for high-precision flexible material processing.
Roll-to-Sheet Handling
Automatic unwinding and vacuum chuck handling support production workflows for roll materials and sheet-format output.
Dual-Platform Efficiency
Dual heads and dual processing platforms can run synchronously to improve throughput for qualified production tasks.
Applications for Flexible Electronics and Functional Film Cutting
GKS-0605D-PI is positioned for high-precision roll-to-sheet cutting of flexible circuits, coverlay films, functional films, adhesive materials and composite film stacks.
FPC & Coverlay Cutting
Profile cutting for FPC substrates, CVL coverlay films and flexible circuit manufacturing workflows.
PI / PET / PP Film
Precision cutting of PI, PET, PP and similar thin flexible film materials where low heat influence is required.
Adhesive & 3M Tape
Cutting adhesive film, 3M adhesive tape and laminated adhesive structures for electronic assemblies.
EMI Shielding Film
Processing electromagnetic shielding films and protective functional films for flexible electronics.
FR4 & PI Stiffener
Cutting FR4 auxiliary materials, PI stiffeners and other supporting flexible circuit components.
Composite Film Stacks
Single-pass cutting of composite workpieces made from multiple materials and different thicknesses after process validation.
Where GKS-0605D-PI Fits — and Where It Doesn't
This page is positioned for picosecond roll-to-sheet precision cutting. Use the selection notes below to avoid confusing it with CO2 PET film cutting, UV/green precision cutting, glass drilling or thick glass processing systems.
Best for
- Roll-to-sheet PI, PET, FPC and CVL processing
- FPC coverlay, adhesive film and composite film cutting
- High-precision flexible material cutting with CCD positioning
- Dual-head dual-platform production workflows
- Projects needing low thermal influence and narrow, smooth kerfs
Not for — use a different model
- Simple PET, OCA and polarizer film cutting → DC0605 PET film cutter
- PCB depaneling, camera module and UV/green cutting → GWK-UV4065 UV / green laser cutter
- Glass hole drilling → GKS-0605-GD precision glass drilling machine
- Thick glass cutting and splitting → GKS-0706-GC thick glass cutting and splitting machine
- Cover glass contour cutting → GWK-BL6050 ultrafast laser glass cutting machine
Not sure whether GKS-0605D-PI is suitable for your roll or film stack?
Send the material type, roll width, thickness, layer structure, drawing and edge quality requirement. GWEIKE engineers will review whether a picosecond roll-to-sheet configuration is suitable.
Send Material Details
GKS-0605D-PI Technical Parameters
Key reference specifications for the GKS-0605D-PI roll-to-sheet precision laser cutting machine. Final cutting quality and configuration should be confirmed through sample testing and engineering review.
| Item | GKS-0605D-PI |
|---|---|
| Machine Model | GKS-0605D-PI |
| Product Type | Roll-to-Sheet Precision Laser Cutting Machine |
| Laser Wavelength | 532 nm / 355 nm |
| Laser Output Power | 30 W / 50 W / 60 W / 80 W optional |
| Machine Structure | Marble X / Y / Z motion platform |
| Laser Repetition Rate | 500 kHz–1000 kHz |
| Cooling Mode | Water cooling |
| XYZ Max Running Speed | X: 500 mm/s; Y: 500 mm/s; Z: 10 mm/s |
| XYZ Axis Travel | X: 600 mm; Y: 500 mm; Z: 50 mm |
| Power Supply | AC380V 50Hz / 5 kW |
| Equipment Size | 1600 × 1750 × 2000 mm |
| Weight | Approx. 2,500 kg |
| Environmental Temperature / Humidity | 23 ± 3 ℃ / ≤60% RH |
| Platform Positioning Accuracy | ±0.005 mm |
| Platform Repeat Positioning Accuracy | ±0.002 mm |
| Overall Machining Accuracy | ±0.03 mm under GWEIKE standard operating conditions |
| Galvanometer Scanning Range | 45 × 45 mm |
| Maximum Processing Format | 600 × 300 mm, customizable |
Reference specifications are based on the standard catalog configuration. Actual cutting quality, kerf width, carbonization control and throughput depend on material type, layer structure, thickness, drawing complexity, fixture condition and selected process parameters.
Related Precision Laser Solutions
Compare GKS-0605D-PI with other GWEIKE micro and nano laser processing systems for CO2 film cutting, UV/green cutting, glass drilling and ultrafast glass cutting.
FAQ
Common questions about GKS-0605D-PI picosecond roll-to-sheet precision laser cutting, material compatibility and sample testing.
What materials can GKS-0605D-PI cut?
It is designed for FPC substrates, CVL coverlay films, PI film, PET film, PP film, adhesive film, EMI shielding film, FR4, 3M adhesive tape, PI stiffener, PE film and other composite flexible materials.
Is GKS-0605D-PI a CO2 laser cutting machine?
No. It is a picosecond precision laser cutting system with 532 nm / 355 nm wavelength configurations. For CO2 sealed RF cutting of simpler PET, OCA and polarizer films, use DC0605 PET film cutter.
What is the difference between GKS-0605D-PI and DC0605?
DC0605 is used for simpler non-metal thin film cutting with a CO2 sealed RF laser. GKS-0605D-PI is built for higher-precision roll-to-sheet FPC, CVL, PI/PET film and composite film workflows.
What is the maximum processing format?
The reference maximum processing format is 600 × 300 mm and can be customized depending on material format, drawing size and automation requirements.
Why use dual-head dual-platform processing?
The beam-splitting system allows one laser source to operate through two beams, enabling dual heads and dual platforms to process synchronously for qualified production workflows.
What should I send for sample testing?
Please send material type, roll width, sheet size, thickness, material stack structure, drawing file, tolerance requirement, edge quality requirement and expected production volume.
Validate Your Roll-to-Sheet Cutting Process Before Buying
Send your FPC, CVL, PI film, PET film, adhesive film or composite material details. GWEIKE engineers will review the application and recommend whether GKS-0605D-PI picosecond roll-to-sheet precision cutting is suitable for your process.
Material review · Sample testing advice · Process recommendation · Quote based on configuration
Request a Roll-to-Sheet Cutting Review
Share your material type, roll width, thickness, layer stack, drawing file and edge quality requirement. Our team will review your application and recommend the right setup.