Laser Path Formation
The 1064 nm infrared picosecond laser forms a controlled cutting path on the glass according to the drawing.
Dual-function laser system for thick glass up to 12 mm. It combines 1064 nm infrared picosecond laser cutting with 10.6 μm splitting to support smooth, stable and efficient thick glass processing.
GKS-0706-GC is designed for thick glass parts that require controlled cutting paths, stable splitting and reliable edge quality.
This thick glass cutting and splitting machine combines two laser processes in one platform. The infrared picosecond laser creates a controlled processing path, while the splitting process assists glass separation along the designed contour.
Compared with conventional mechanical cutting methods, laser-based thick glass processing reduces tool wear and helps improve edge consistency. It is suitable for security glass, home appliance glass, smart home panels, automotive glass and industrial glass components.
The infrared picosecond laser provides high peak energy for thick glass processing. It creates controlled cutting paths that prepare the glass for stable splitting and separation.
The machine supports fast thick glass processing, with linear speed up to 500 mm/s and curved speed up to 300 mm/s under suitable material and process conditions.
Laser cutting and splitting help reduce mechanical stress, fragments and edge defects. Final edge quality should be verified with your actual glass type, thickness and contour design.
The system is not only a cutting machine. It combines laser path processing and splitting assistance for thick glass separation.
The 1064 nm infrared picosecond laser forms a controlled cutting path on the glass according to the drawing.
The 10.6 μm splitting process assists controlled separation along the processed path for thick glass parts.
Edge smoothness, strength and separation quality are confirmed by sample testing based on actual glass and contour requirements.
Built for thick glass, stable separation and reduced mechanical damage compared with traditional cutting methods.
One platform combines infrared picosecond cutting and CO2 splitting for thick glass processing.
Supports thick glass processing for security, appliance and industrial applications.
Linear processing speed can reach up to 500 mm/s under suitable process conditions.
±0.002 mm repeat positioning accuracy supports stable batch processing.
Non-contact laser processing helps reduce microcracks, fragments and mechanical stress.
Use this section to select the correct ultrafast glass processing system for your part.
Use sample testing to verify edge quality, splitting stability and contour accuracy before purchase. Final results depend on glass material, thickness, contour shape and process setup.
Designed for thick glass parts used in security, appliance, smart home, automotive and industrial glass manufacturing.
Thick glass parts requiring stable separation and controlled edge quality.
Glass panels for home appliance covers, control panels and decorative parts.
Glass components for touch panels, control interfaces and smart home products.
Specialized glass contours and industrial glass components for automotive-related uses.
Customized thick glass parts for industrial equipment and component manufacturing.
Key specifications for GKS-0706-GC thick glass cutting and splitting machine. Final cutting quality should be verified by sample testing on your actual glass material.
| Item | GKS-0706-GC |
|---|---|
| Machine Model | GKS-0706-GC |
| Processing Range | 650 × 650 mm |
| Laser Wavelength | Cutting 1064 nm / Splitting 10.6 μm |
| Repeat Positioning Accuracy | ±0.002 mm |
| Processing Speed | Max 500 mm/s |
| Power Requirement | AC 220 V / 18 A, 5 kW |
| Processing Thickness | ≤12 mm |
| Laser Power | 30 W / 50 W / 70 W optional |
| Comprehensive Processing Accuracy | ±0.01 mm within ≤200 mm |
| Laser Safety Level | Class IV |
| Single Machine Size | 1800 × 2000 × 1950 mm |
Explore related GWEIKE ultrafast glass processing systems for thin glass cutting, glass drilling, precision film cutting and ceramic processing.
Common questions about GKS-0706-GC thick glass cutting and splitting machine.
It supports thick glass cutting and splitting up to 12 mm. Final quality depends on glass type, thickness, contour and process parameters.
The 1064 nm laser creates a controlled cutting path, while the 10.6 μm splitting process assists glass separation along that path.
It is mainly designed for thick glass cutting and splitting. For thin cover glass contour cutting, use GWK-BL6050 glass cutting machine.
Typical applications include security glass, household appliance glass, smart home panels, automotive glass and industrial glass components.
Yes. You can send the glass material, thickness, contour drawing and quality target for process review and machine configuration advice.
Please provide glass type, thickness, cutting shape, drawing file, expected edge quality, tolerance requirement and production volume.
Send your glass type, thickness, contour drawing and target edge quality. GWEIKE engineers will review your application and recommend a suitable process window and machine configuration.
Share your glass material, thickness, cutting contour, drawing file and target edge quality. Our team will review your application and recommend the right setup.