Ultrafast Series
Integrated Thick Glass Cutting and Splitting Machine
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Infrared picosecond laser, high peak energy vaporizes the glass directly at the thread penetration point, forming holes, applying external force can easily and efficiently split.
Fast cutting speed,
linear speed up to 500mm/s,
curved speed up to 300mm/s.
No microcracks, breakage,
or fragment issues,
high edge fracture resistance.
Consumer electronics, automotive industry, security industry, smart homes
| Machine model | GKS-0706-GC |
|---|---|
| Processing Range | 650mm x 650mm |
| Laser Wavelength | Cutting 1064nm/Splitting 10.6um |
| Repeat Positioning Accuracy | ±0.002mm |
| Processing Speed | MAX 500mm/s |
| Power Requirement | AC220V/18A 5KW |
| Processing Thickness | ≤12mm |
| Laser Power | 30W/50W/70W optional |
| Comprehensive Processing Accuracy | ±0.01mm (≤200mm) |
| Laser Safety Level | Class IV |
| Single Machine Size | 1800mm x 2000mm x 1950mm |
