Fine Drilling
High-energy laser beams support precise glass drilling with reduced burrs and improved processing yield.
Ultrafast laser drilling system for cover glass, electronic glass substrates, appliance glass, backlight glass and thin-film solar panels. Designed for fine holes, irregular hole shapes and low-chipping glass processing.
The GKS-0605-GD uses ultrafast laser processing for fine glass drilling where edge quality, accuracy and yield matter.
This precision glass drilling machine is built for glass parts that require controlled hole geometry and clean processing. It supports multiple hole shapes, including round holes, square holes, slot holes, triangular holes and irregular holes.
Compared with traditional mechanical drilling, ultrafast laser glass drilling is non-contact and reduces tool wear. It is suitable for applications where small chipping, stable positioning and repeated hole groups are required.
GKS-0605-GD uses high-energy laser processing for precision glass hole drilling. Non-contact processing helps reduce mechanical stress, burrs and edge defects compared with conventional mechanical drilling methods.
One machine supports multiple hole shapes for functional glass components, including circular holes, square holes, waist-shaped holes, triangular holes and customized irregular hole patterns based on your drawing.
The platform combines an adsorption fixture, dust extraction device and mirror correction system to support stable, clean and efficient hole-group processing for glass production workflows.
Focused on fine glass drilling, process stability and efficient handling of different glass hole types.
High-energy laser beams support precise glass drilling with reduced burrs and improved processing yield.
Supports round, square, waist-shaped, triangular and other irregular holes for functional glass parts.
Typical chipping range is 60–300 μm, depending on glass type, thickness, hole geometry and process settings.
Special adsorption fixture platform helps stabilize glass sheets during repeated hole processing.
Integrated dust extraction and non-contact processing support cleaner and safer glass machining.
Process standard and irregular holes according to your part drawing and application requirements.
Process round holes, shaped holes and hole groups on glass with controlled edge quality. Final chipping and edge condition should be confirmed by sample testing on your actual material.
Designed for precision glass parts used in electronics, displays, appliances and solar-related glass processing.
Camera holes, sensor holes, positioning holes and high-value cover glass processing.
Precision holes for electronic glass substrates and display-related components.
Alignment and assembly hole processing for display and backlight glass parts.
Control panels, functional holes and customized household appliance glass.
Thin-film solar panel substrate drilling and process preparation.
Use this section to avoid choosing the wrong ultrafast glass processing equipment.
Learn more about ultrafast glass processing, laser drilling, low chipping, process parameters and related precision laser solutions.
Understand ultrafast glass cutting, edge quality, low chipping and common glass laser applications.
Read guide →Learn how ultrafast lasers are used for glass cutting, precision drilling, sapphire and electronics processing.
Read guide →Review glass laser process windows, quality factors, chipping control and production qualification points.
Read guide →Compare precision laser solutions for glass, FPC, PI film, PET film and micro-nano processing.
View solutions →Get GWEIKE catalog resources for ultrafast glass cutting, glass drilling and precision laser processing.
Download catalog →Key specifications for GKS-0605-GD precision glass drilling machine. Final performance for your part is confirmed by a sample test based on your glass type, thickness, hole size and drawing.
| Item | GKS-0605-GD |
|---|---|
| Machine Model | GKS-0605-GD |
| Laser Wavelength | 532 nm / 1064 nm optional |
| Laser Power Options | 30–120 W optional |
| Processing Area | 600 × 500 mm customizable |
| Machining Thickness | ≤15 mm |
| Chipping Typical Range | 60–300 μm |
| Beam Quality | ≤1.3 |
| Laser Safety | Class IV |
| Max Scan Speed | 8000 mm/s |
| Repeatability | ±0.002 mm |
| Comprehensive Accuracy | ±0.03 mm within ≤300 mm |
| Cooling | Water-cooling |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30–60% |
| Power Requirement | AC 220 V / 22.5 A, 5 kW |
| Machine Size W×D×H | 1890 × 1580 × 1900 mm |
Explore related GWEIKE ultrafast glass laser systems, catalog resources and drawing review support for precision glass processing projects.
It supports glass machining thickness up to 15 mm. The final drilling quality depends on glass type, thickness, hole size and process settings.
It can process circular holes, square holes, waist-shaped or slot holes, triangular holes and other irregular hole shapes based on the drawing.
No. ±0.002 mm is repeatability. The comprehensive accuracy listed for this machine is ±0.03 mm within 300 mm.
532 nm and 1064 nm are optional. The better choice depends on glass material, thickness, hole size and edge quality target.
No. It is designed for hole drilling. For cover glass contour cutting, use GWK-BL6050 ultrafast glass cutting machine.
Please send glass type, thickness, hole size, drawing file, target chipping range and production volume. This helps engineers confirm feasibility and configuration.
Yes. You can send the glass material, thickness, hole drawing and quality target. GWEIKE engineers can review the process and provide configuration advice before purchase.
Send your glass type, thickness, hole drawing and target edge quality. GWEIKE engineers will review the application and recommend a suitable process window and machine configuration.
Share your glass type, thickness, hole geometry, drawing file and target quality requirement. Our team will review your application and recommend the right setup.