Picosecond Ultrafast Laser
Glass Cutting Machine
For smartphone cover glass, sapphire camera covers and LCD display manufacturers who need sub-10 μm chipping at production speed. Non-thermal picosecond processing, validated by sample-cut reports on your actual material.
High-throughput picosecond laser glass cutting at 500 mm/s
Dual robotic arms load and unload synchronously, keeping the laser head on the part for maximum utilization. Typical cycle is around 4 seconds per 115 × 60 mm cover glass piece with R5 corner radius.
≤10 μm chipping for cover glass and sapphire cutting
Picosecond ultrafast laser controls edge chipping to typical ≤10 μm on selected cover glass applications. Non-contact processing means low mechanical stress and reduced subsurface microcrack risk, supporting higher edge fracture strength after tempering.
Cold processing with picosecond ultrafast laser
Picosecond pulses deliver energy faster than heat can spread — minimal heat-affected zone (HAZ) and low microcrack risk. High photoelectric conversion rate gives long equipment lifespan and stable optical performance across long production runs.
Application industries
Tempered and untreated cover glass, sapphire camera covers, LCD glass covers, special-shaped cutting for full-screen displays, chamfering and other optical glass materials.
Where this machine fits — and where it doesn't
Honest scope helps you pick the right tool the first time.
✓ Best for
- Smartphone & wearable cover glass, 0.3 – 1.4 mm
- Sapphire camera covers and lens covers
- LCD / OLED display cover glass shaping
- Special-shaped contour cutting on tempered glass
- Edge chamfering on optical glass materials
✗ Not for — use a different model
- Glass thicker than 1.4 mm → GKS-0706-GC thick glass cutter
- Through-hole drilling in glass → GKS-0605-GD drilling machine
- FPC, PCB or thin film cutting → GWK-UV4065 UV / green cutter
- PI / PET / OCA film roll-to-sheet → DC0605 film cutter
Technical Parameters
Reference values for the GWK-BL6050 platform. Final performance for your part is confirmed by a sample test.
| Parameter | GWK-BL6050 |
|---|---|
| Laser Wavelength | 1064 nm |
| Laser Power (options) | 30 / 50 / 70 W |
| Cutting Range | 200 × 200 mm (dual tables) |
| Max Speed (straight) | 500 mm/s |
| Max Speed (curve) | 300 mm/s |
| Chipping (typ.)* | ≤10 μm on selected applications |
| Machining Thickness | ≤1.4 mm |
| Repeatability | ±0.002 mm |
| Comprehensive Accuracy | ±0.01 mm |
| Laser Safety | Class IV |
| Cooling | Water-cooling |
| Power Requirement | AC 220 V / 20.5 A, 4.5 kW |
| Machine Size (W × D × H) | 1680 × 1560 × 1950 mm |
| Ambient Temperature / Humidity | 22 ± 2 ℃ / 30 – 60% |
| Beam Quality | ≤1.3 |
*Performance values are typical and vary by model, material, thickness, fixture and process settings. Verify with a sample test on your actual material.
Frequently asked questions
Quick answers to the questions buyers ask most.
What's the maximum glass thickness GWK-BL6050 can process?
Up to 1.4 mm typical. For thicker substrates (up to 12 mm), use GKS-0706-GC thick glass cutting and splitting machine.
Does it work on chemically strengthened (tempered) cover glass?
Yes. Picosecond ultrafast laser is suitable for tempered cover glass with low chipping risk. Edge strength after tempering depends on chipping depth, which we verify through sample testing on your actual material.
What's the typical edge chipping value?
Typically ≤10 μm on selected cover glass applications (0.3 – 1.4 mm). Actual values vary with material type, thickness, geometry and process parameters.
Picosecond vs femtosecond — which is right for cover glass?
Picosecond gives close-to-femtosecond edge quality at significantly lower system cost and complexity. For most consumer cover glass production lines, picosecond is the better ROI choice. Femtosecond is reserved for ultra-high-end optical applications.
How does GWK-BL6050 compare to CO₂ glass cutting?
CO₂ laser uses thermal cutting (melt zone), suitable for thin films and thicker glass with crack-control workflows. Picosecond ultrafast is non-thermal, giving lower chipping and microcrack risk on cover glass and sapphire. Different processes for different materials.
Can GWK-BL6050 drill through-holes in glass?
No. GWK-BL6050 is designed for contour cutting. For glass drilling, use GKS-0605-GD precision glass drilling machine.
What laser source is used inside GWK-BL6050?
Industrial-grade picosecond IR laser at 1064 nm, with 30 / 50 / 70 W power options. Specific source brand and warranty terms are provided in your formal quotation after sample-test review.
Does it require a clean room or special facility?
Standard industrial environment (22 ± 2 °C, 30 – 60% RH) with stable AC 220 V power and water-cooling supply. Class IV laser safety enclosure is included. Clean room is not required for cover glass production.
How long does a sample test take?
Typically 5 – 10 business days after we receive your material and drawing files. Complex parts requiring custom fixturing may take longer.
What about installation, training and warranty?
GWEIKE provides on-site installation, operator training and a standard warranty (terms vary by region). Contact sales for the warranty document covering your country.
Validate the process on your own material — before you commit
Send a sample part. GWEIKE application engineers will cut it on GWK-BL6050 and return a measured report covering chipping size, edge strength, cycle time and recommended process window. Typically within 5 – 10 business days. Free for qualified inquiries.
Request a Sample Test
Share your glass type, thickness, drawing file, target edge quality, and production requirement. GWEIKE engineers will review your application and recommend the right process window.