Precision laser cutting machines for materials where
microns decide yield
High-precision laser cutting for cover glass, thick glass, FPC, PI film, PET film and PV glass. GWEIKE matches the right laser source — picosecond, UV, MOPA or CO₂ — to your part, not the other way around.
*Performance values are typical and vary by model, material, thickness, fixture and process settings. Verify with a sample test.
What makes a laser cutting machine actually precise
Precision is not one number on a spec sheet. It is a combination of laser source matching, motion accuracy, fixturing, and validated process windows on your specific material. Here is how the GWEIKE precision laser platform addresses each.
Right laser for the material
Picosecond IR for cover glass, UV / green for FPC and PCB, MOPA for drilling and CO₂ for film. Wrong source = wasted precision.
Motion & positioning
Linear motor stages with ±0.002 mm repeatability on selected models. CCD vision alignment for print-to-cut workflows on flexible substrates.
Process windows, not single numbers
Edge quality depends on pulse energy, repetition rate, focus position and scan strategy. Each application has a validated window, not just one parameter set.
Sample-based qualification
Final acceptance is always a measured sample report: chipping, microcrack depth, edge strength, dimensional tolerance. Spec sheets alone do not qualify a process.
Precision laser cutting specs by application
Typical performance ranges across the GWEIKE precision laser platform. Final numbers for your part come from a sample test report on your actual material.
| Application | Typical thickness | Typical chipping / kerf | Repeatability | Recommended source |
|---|---|---|---|---|
| Cover glass cutting | 0.1–1.4 mm | ≤10 μm chip* | ±0.01 mm | Picosecond IR |
| Glass drilling | 0.3–15 mm | 60–300 μm* | ±0.03 mm | MOPA |
| Thick glass cut + split | 2–12 mm | Low microcrack risk | ±0.01 mm | Picosecond IR + CO₂ |
| FPC / PCB depaneling | ≤2 mm | No carbon edge | ±0.03 mm | UV / Green picosecond |
| PI / PET / OCA film cutting | ≤1 mm | 80–150 μm kerf | ±0.05 mm | Sealed CO₂ |
| PV glass punching | ≤2.5 mm | Production cycle | ±0.1 mm | MOPA × 3 heads |
*Typical values on selected applications. Performance varies by model, material and process settings.
Looking for ultrafast (picosecond / femtosecond) systems?
Picosecond ultrafast laser cutting is a sub-category of precision laser cutting, designed specifically for brittle materials and minimal heat-affected zones.
Eight precision laser cutting machines
Click any model for full specs and configuration details.
Precision laser cutting — what buyers ask first
Quick answers to the questions that come up in most procurement conversations. For application-specific advice, send your material and drawing for a sample test.
What is a precision laser cutting machine?
A precision laser cutting machine produces small kerf width, low edge defects and tight positioning accuracy, typically using picosecond, UV, fiber or CO₂ laser sources matched to the material and tolerance target.
How precise is laser cutting in microns?
Industrial precision laser cutting machines reach repeatability of about ±0.002 to ±0.01 mm and edge chipping of 5–80 microns depending on laser source, material and process parameters.
Which laser type is most precise for glass and film?
For brittle glass and heat-sensitive films, ultrafast picosecond laser cutting typically gives the lowest chipping and microcrack risk. UV and CO₂ sources may be more suitable for film, FPC and large-format work depending on application.
How do I choose the right precision laser machine?
Start from the part: material, thickness, geometry, edge tolerance and production volume. Then select the laser source and motion configuration. A sample test on real material is the most reliable validation step.
Test the precision on your actual material
Send a sample part with your tolerance target. GWEIKE engineers will recommend the right precision laser configuration and return a measured cut report.