Main model
GWK-BL6050
Cover glass cutter
Thickness≤1.4mm
Chipping≤10μm
Speed500mm/s
Accuracy±0.01mm
Best for: Smartphone and wearable cover glass, sapphire camera covers, LCD display glass and precision thin glass cutting.
Ultrafast laser cutting platform · 8 application-matched machines
Sub-10μm chipping on cover glass
500mm/s production speed
for glass, films, FPC & PV glass
High-precision ultrafast laser cutting from smartphone cover glass with ≤10μm typical chipping on selected applications to roll-to-sheet PI and PET film — GWEIKE matches picosecond, UV / green, MOPA and CO₂ laser configurations to each material and production target.
≤10μm
Selected glass chipping
500
mm/s linear speed*
±0.002
mm repeatability*
8
Machine configurations
*Performance varies by model, material, thickness, fixture and process settings. Verify final results with a sample test.
01 / Start here
Choose by what you need to process
Most buyers do not start with a machine model. They start with a material, a thickness range and a yield target. These three paths help procurement teams and process engineers narrow the platform quickly.
Cover glass & consumer electronics
Smartphone, smartwatch, camera cover, sapphire and display glass applications — high-precision glass cutting where edge strength and low chipping affect yield.
Thick, industrial & PV glass
Automotive displays, home appliance glass, security glass, PV backsheet glass and production-line drilling or splitting workflows.
FPC, PCB & functional films
High-precision UV / green picosecond laser cutting for FPC shaping, rigid-flex boards, PI film, PET film, OCA film, polarizer and roll-to-sheet automated cutting.
02 / 30-second selector
Get a first machine recommendation before you send samples
This selector is not a final engineering quotation. It helps your team choose the right starting point for discussion and sample testing.
Recommended starting point
Select your material, thickness and production goal, then click Get my machine.
03 / Process logic
Why ultrafast laser selection depends on material, not only power
Glass, functional films and electronics substrates fail in different ways: chipping, microcracks, carbonization, heat affected zones or alignment errors. That is why the platform uses different laser sources and motion configurations.
| Process route | Typical edge issue | Thermal effect | Positioning focus | Best-fit applications |
|---|---|---|---|---|
| Mechanical wheel / diamond | Higher chipping risk | Low heat, mechanical stress | Tool wear control | Low-cost flat panels |
| CO₂ laser film cutting | Kerf control | Material-dependent | Roll feed / CCD alignment | PI, PET, OCA, polarizer |
| UV / green picosecond | No burr / no carbon target | Low thermal impact | Galvo and dual platform | FPC, PCB, camera module |
| Picosecond glass cutting / splitting | Low chipping target | Low microcrack risk | High repeatability | Cover glass, thick glass, display glass |
Values and outcomes depend on material grade, thickness, fixture, optics, process window and inspection method. Use sample testing for final validation.
04 / The platform
Eight machines, four laser configurations, one supplier
Filter by laser source or application. Each card shows the key numbers that help engineers and procurement teams decide which product page to review first.
GKS-0605-GD
Precision glass drilling machine
Thickness≤15mm
Chipping60–300μm
Scan speed8000mm/s
Accuracy±0.03mm
Best for: Cover glass holes, appliance glass, electronic glass substrates, backlight glass and thin-film solar substrates.
GKS-0706-GC
Thick glass cut + split
Thickness≤12mm
MicrocracksLow risk
Speed500mm/s
Accuracy±0.01mm
Best for: Automotive displays, smart appliances, security glass and smart-home glass panels requiring controlled splitting.
GSK-0706D-GC
Dual-platform cut + split
Thickness≤12mm
Worktables2 × 400×500
Speed500mm/s
Accuracy±0.02mm
Best for: High-volume thick glass production using front cutting and back splitting to improve line throughput.
GWK-UV4065
UV / green precision cutter
Thickness≤2mm
EdgeNo carbon
Scan speed6000mm/s
Accuracy±0.03mm
Best for: FPC shaping, rigid-flex PCB depaneling, camera modules and fingerprint recognition module cutting.
DC0605-PI
Roll-to-sheet PI film cutter
Film thickness≤1mm
Kerf80–150μm
Speed300mm/s
Accuracy±0.05mm
Best for: FPC coverlay film, polyimide film and electromagnetic shielding film in automated roll-to-sheet workflows.
DC0605-PET
PET film cutter
Film thickness≤1mm
Kerf80–150μm
Speed300mm/s
Accuracy±0.05mm
Best for: OCA film, polarizer, screen protectors and DTF PET film where CCD print-to-cut alignment is needed.
GKS-1210-GD
PV glass punching line
Glass thickness≤2.5mm
Sheet size≤2500×1500mm
Cycle≤6s/hole
Accuracy±0.1mm
Best for: PV backsheet glass punching, embossed glass, automotive glass and camera cover drilling with production-line integration.
05 / Selection guide
How to choose an ultrafast or precision laser cutting machine
A good selection process should start from the part, not from the laser source name. Use the questions below to prepare a technical inquiry or sample test.
Which laser source is best for cover glass cutting?
Picosecond IR laser cutting is commonly used for cover glass, sapphire camera covers and display glass where low chipping, edge strength and repeatable non-contact processing are required.
Is precision laser cutting the same as ultrafast laser cutting?
Precision laser cutting is a broader category that includes UV nanosecond, fiber and CO₂ systems. Ultrafast (picosecond / femtosecond) is a sub-category designed for brittle and heat-sensitive materials where every micron of edge quality matters.
When should I choose CO₂ for film materials?
CO₂ sealed laser systems are suitable for PI film, PET film, OCA film and polarizer materials where roll-to-sheet automation, stable kerf width and clean edge appearance are important.
What information is needed for a sample test?
Material type, thickness, drawing file, tolerance requirement, edge quality target, inspection method and expected production volume help engineers recommend the right machine and process window.
How do I evaluate a high-precision glass cutting machine?
Compare four numbers from a real sample cut: edge chipping (microns), microcrack depth, four-point bending strength, and cycle time per part. Spec sheet numbers without a measured sample report are not enough for production qualification.
Can one machine cut all glass and film materials?
No. Brittle glass, thick glass, FPC, PI film, PET film and PV glass drilling require different laser sources, optics, motion platforms and fixtures.
06 / Built on
Two decades of laser manufacturing and application testing
GWEIKE built the world's most powerful industrial fiber laser at 135 kW. The same R&D team, supply chain and global service network back every machine in this ultrafast platform — Powering Precision, Shaping the Future.
135kW
World's most powerful industrial fiber laser
2004
Founded · 20+ years
180+
Countries served
200Km²
Production area
20K+
Units shipped annually
130+
Patents granted
Certified & recognized by
iF Design Award 2024
CE
FDA
ISO 9001
Send your material. Validate the process before buying.
Share your material type, thickness, drawing file, tolerance target and production goal. GWEIKE application engineers can recommend the right precision laser configuration and discuss sample testing or quotation details.
Material-based model advice
Sample test discussion
Process parameter review
NDA available on request
